1. 2. 3. material content data sheet sales product name tle42694e issued 28. august 2013 ma# MA000969726 package pg-ssop-14-2 weight* 83.37 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 2.391 2.87 2.87 28678 28678 leadframe inorganic material phosphorus 7723-14-0 0.009 0.01 103 non noble metal zinc 7440-66-6 0.034 0.04 413 non noble metal iron 7439-89-6 0.689 0.83 8265 non noble metal copper 7440-50-8 27.978 33.56 34.44 335577 344358 wire noble metal gold 7440-57-5 0.278 0.33 0.33 3339 3339 encapsulation organic material carbon black 1333-86-4 0.098 0.12 1178 plastics epoxy resin - 4.516 5.42 54167 inorganic material silicondioxide 60676-86-0 44.473 53.33 58.87 533430 588775 leadfinish non noble metal tin 7440-31-5 0.976 1.17 1.17 11708 11708 plating noble metal silver 7440-22-4 0.768 0.92 0.92 9207 9207 glue plastics epoxy resin - 0.290 0.35 3484 noble metal silver 7440-22-4 0.871 1.05 1.40 10451 13935 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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